Capabilities

Board Types Manufactured	Multilayer, PTH, Conventional
Surface Finishes	HASL, Electroless Nickel/Gold, Organic Silver, Black Oxide, Glicoat
Solder Resist Types	Photo-Imageable, U.V. Cured, 2 Pack Epoxy
Annotation Types	Single Pack Epoxy, Photo-Imageable, U.V. Cured
Removable Solder Mask	Peelable Mask, Water Soluble Mask
Layers	1 Layer to 16 Layers
Material	FR4 Glass Fibre, FR2 Phenolic Paper, CEM All Grades
Profile	CNC Routing, V-Score
Approvals	ISO 9002 Approved, UL Recognised Component
Full Laboratory Testing	All tests are performed in accordance with BS6221
Etching	Ammonical etch constant speed.

Copper Weight *	18 microns to 70 microns
Maximum Circuit Size *	55.8 cm * 30.5 cm
Minimum Track Width *	0.2 mm
Minimum Hole Size *	0.4 mm
Minimum Gap *	0.2 mm
Maximum Aspect Ratio *	4 : 1
Tin/Lead Minimum Thickness	5 microns
Gold Thickness [Tab Plating]	0.2 to 5 microns
Nickel Thickness [Tab Plating]	1 to 8 microns
Minimum Annular Ring	0.325 mm larger than hole size
Solder Resist Clearance- Imageable	0.050 mm [Recommended]
Solder Resist Clearance- Wet	0.150 mm [Recommended]

* These are regarded as standard values. Other values can be achieved by discussion.

Drilling & Profiling
Drill positional accuracy	± 0.05 from program position
Rout positional accuracy	± 0.10 from program position

Specifications & Tolerances
Minimum Track/Gap	.004”/.004”
Minimum Hole Size	.008”
Minimum Feature to Edge	.010”
Minimum Thickness Tolerance	.010”
Plated Through Hole Tolerance	.003”
Minimum Soldermask Clearance	.004”
Controlled Impedance Tolerance	10%
Minimum Pad to PTH	.006”

Tighter tolerances are achievable by design.

Multilayer 3 to 40 layers-buried and blind vias Thickness 0.20mm to 8.0mm

Inner Layer Copper Weight

Outer Layer Copper Weight

Finishes

Materials

Utilising ATG A3 flying probe test systems. Fixture testing also available.