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Fax: 0121 322 2176

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Capabilities


Board Types Manufactured Multilayer, PTH, Conventional
Surface Finishes HASL, Electroless Nickel /Gold, Organic Silver, Black Oxide, Glicoat
Solder Resist Types Photo-Imageable, U.V. Cured, 2 Pack Epoxy
Annotation Types Single Pack Epoxy, Photo-Imageable, U.V. Cured
Removable Solder Mask Peelable Mask, Water Soluble Mask
Layers 1 Layer to 16 Layers
Material FR4 Glass Fibre, FR2 Phenolic Paper, CEM All Grades
Profile CNC Routing,  V-Score
Approvals ISO 9002 Approved, UL Recognised Component
Full Laboratory Testing All tests are performed in accordance with BS6221
Etching Ammonical etch constant speed.


Copper Weight * 18 microns to 70 microns
Maximum Circuit Size * 55.8 cm * 30.5 cm
Minimum Track Width * 0.2 mm
Minimum Hole Size * 0.4 mm
Minimum Gap * 0.2 mm
Maximum Aspect Ratio * 4 : 1
Copper Minimum Thickness 20 microns
* These are regarded as standard values. Other values can be achieved by discussion.
Tin/Lead Minimum Thickness 5 microns
Gold Thickness [Tab Plating] 0.2 to 5 microns
Nickel Thickness [Tab Plating] 1 to 8 microns
Minimum Annular Ring 0.325 mm larger than hole size
Solder Resist Clearance- Imageable 0.050 mm [Recommended]
Solder Resist Clearance- Wet 0.150 mm [Recommended]
   

Drilling & Profiling  
Drill positional accuracy. ± 0.05 from program position
Rout positional accuracy. ± 0.10 from program position

Specifications & Tolerances  
Minimum Track/Gap .004”/.004”
Minimum Hole Size .008”
Minimum Feature to Edge .010”
Minimum Thickness Tolerance .010”
Plated Through Hole Tolerance .003”
Minimum Soldermask Clearance .004”
Controlled Impedance Tolerance 10%
Minimum Pad to PTH .006”
   
Tighter tolerances are achievable by design  

Multilayer Capabilities

Multilayer 3 to 40 layers-buried and blind vias`s Thickness 0.20mm to 8.0mm


Inner Layer Copper Weight
  • 12µ
  • 18µ / ˝oz
  • 35µ / 1oz
  • 70µ / 2oz
  • 105µ / 3oz
  • 140µ / 4oz
  • others on request
Outer Layer Copper Weight
  • 9µ / Ľoz
  • 12µ
  • 18µ / ˝oz
  • 35µ / 1oz
  • 70µ / 2oz
  • 105µ / 3oz
  • 140µ / 4oz
  • others on request

Materials

  • CEM1
  • CEM3
  • FR2
  • FR4
  • FR4 Halogen Free
  • FR5 (High TG & High Frequency)
  • Aluminium Based
  • Aramids
  • Arlon 25N/25FR
  • Nelco Materials
  • Polyimide
  • PTFE
  • Rogers Materials

Finishes

  • OSP (Organic Solderability Preservative)
  • Immersion Silver
  • Electroless Nickel/Immersion Gold(E.N.I.G.)
  • Immersion Tin
  • Hard Gold(also to Def.Stan.03-17)
  • Soft Gold
  • Lead-Free HASL(SN100C)
  • Tin/Lead HASL(not RoHS compliant)

Bare Board Test


Utilising ATG A3 flying probe test systems. Fixture testing also available.


Delivery Time

  • 24 hrs
  • 48 hrs
  • 3 days
  • 5 days
  • 7 days
  • 10 days
  • 15 days

PCB Types and RoHS Compliant finishes

  • Single sided
  • Double sided
  • Plated through hole
  • Multilayer 3 to 40 layers.Blind and buried via`s
  • Controlled Impedance
  • Immersion silver
  • Electroless Nickel/Immersion Gold
  • Lead Free Hot Air Solder Level (H.A.S.L.)
  • Tin/Lead H.A.S.L.(NOT RoHS Compliant)
  • Electroplated Nickel/Gold
  • Electroplated Hard Gold
  • Carbon Conductive Ink
  • Peelable Mask